Out-of-plane deformation and pull-in voltage of cantilevers with residual stress gradient: experiment and modelling

被引:0
|
作者
Anna Persano
Jacopo Iannacci
Pietro Siciliano
Fabio Quaranta
机构
[1] IMM-CNR,
[2] Institute for Microelectronics and Microsystem-Unit of Lecce,undefined
[3] National Council of Research,undefined
[4] CMM–FBK,undefined
[5] Center for Materials and Microsystems,undefined
[6] Fondazione Bruno Kessler,undefined
来源
Microsystem Technologies | 2019年 / 25卷
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摘要
The out-of-plane deformation and the pull-in voltage of electrostatically actuated cantilevers with a residual stress gradient, is investigated in the length range 100–300 µm. Measured pull-in voltages are compared with calculations, which are obtained using previously proposed analytical expressions and a finite element method (FEM) modelling. In particular, a simplified model of the residual stress distribution inside cantilevers is formulated that enables FEM simulation of measured out-of-plane deformations and pull-in voltages for all lengths of fabricated cantilevers. The presented experimental results and FEM model are exploitable in the design of cantilever-based microelectromechanical systems, in order to provide a reliable prediction of the influence of residual stress gradient on device shape and pull-in voltage.
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页码:3581 / 3588
页数:7
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