Effect of grain size on the primary and secondary creep behavior of Sn–3 wt.% Bi alloy

被引：0
|
作者：
Alaa Farag Abd El-Rehim
机构：
[1] Ain Shams University,Physics Department, Faculty of Education
来源：
Journal of Materials Science | 2008年 / 43卷
关键词：
Creep Curve; Primary Creep; Secondary Creep; Creep Stage; Creep Temperature;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The effect of grain size as well as creep temperature on the primary and secondary creep parameters of Sn–3 wt.% Bi alloy has been studied. It was found that the creep parameters α, β, and έs were decreased with increasing grain size. This was explained in view of the dislocation interaction with the defects and different inclusions in the matrix. For both the primary and secondary creep, the activation energies estimated indicate that the rate-controlling mechanism is the grain boundary-sliding mechanism.
引用
收藏
页码：1444 / 1450
页数：6
相关论文
共 50 条
  • [31] DEPENDENCE OF CREEP RATE ON GRAIN DIAMETER IN SN-0.5AT-PERCENT-BI ALLOY
    SAAD, G
    ELSALAM, FA
    MOSTAFA, MT
    SURFACE TECHNOLOGY, 1984, 22 (01): : 73 - 79
  • [32] Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder
    Laksono, Andromeda Dwi
    Shen, Yu-An
    Chen, Ting
    Yen, Yee-Wen
    JOM, 2024, 76 (06) : 2754 - 2762
  • [33] Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder
    Andromeda Dwi Laksono
    Yu-An Shen
    Ting Chen
    Yee-Wen Yen
    JOM, 2024, 76 : 2754 - 2762
  • [34] Effect of 3 wt.% Bi in Sn-Zn solder on the interfacial reaction with the Au/Ni metallization in Microelectronic Packaging
    Haque, Md. Obaidul
    Sharif, Ahmed
    PROCEEDINGS OF ICECE 2008, VOLS 1 AND 2, 2008, : 930 - 935
  • [35] Corrosion behavior of Mge5Al based magnesium alloy with 1 wt.% Sn, Mn and Zn additions in 3.5 wt.% NaCl solution
    Nguyen Dang Nam
    JOURNAL OF MAGNESIUM AND ALLOYS, 2014, 2 (02) : 190 - 195
  • [36] Grain size effects on magnetomechanical damping properties of ferromagnetic Fe-5 wt.% Al alloy
    Seo, Young Ik
    Lee, Baek-Hee
    Kim, Young Do
    Lee, Kyu Hwan
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 431 (1-2): : 80 - 85
  • [37] Effect of aluminium additions on wettability and intermetallic compound (IMC) growth of lead free Sn (2 wt. % Ag, 5 wt. % Bi) soldered joints
    Hee Yul Lee
    Ashutosh Sharma
    Se Ho Kee
    Young Woo Lee
    Jung Tak Moon
    Jae Pil Jung
    Electronic Materials Letters, 2014, 10 : 997 - 1004
  • [38] Effect of Copper Addition on Grain Refinement of Austenite in Fe-8wt.%Ni-(0-3)wt.%Cu Alloy
    Syarif, Junaidi
    Sajuri, Zainuddin
    SAINS MALAYSIANA, 2010, 39 (06): : 999 - 1006
  • [39] Effect of annealing and microstructure on the creep behaviour of an Sn-10 wt % Sb alloy
    Yassin, A
    Reuben, RL
    Saad, G
    Beshai, MHN
    Habib, SK
    PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS, 1999, 213 (L1) : 59 - 68
  • [40] Solidification behavior of the remnant liquid in the sheared semisolid slurry of Sn-15 wt.%Pb alloy
    Ji, S
    Das, A
    Fan, Z
    SCRIPTA MATERIALIA, 2002, 46 (03) : 205 - 210
12345