Effect of Atomic Layer Deposited AlN Layer on Pt/4H-SiC Schottky Diodes

被引:3
|
作者
Kim H. [1 ]
Kim N.D. [2 ]
An S.C. [2 ]
Yoon H.J. [2 ]
Choi B.J. [2 ]
机构
[1] Department of Visual Optics, Seoul National University of Science and Technology (Seoultech), Seoul
[2] Departmet of Materials Science and Engineering, Seoul National University of Science and Technology (Seoultech), Seoul
关键词
AlN layer; Interface state density; Reverse leakage current; Trap assisted tunneling;
D O I
10.1007/s42341-018-0058-0
中图分类号
学科分类号
摘要
Thin AlN layer was deposited on n-type 4H-SiC using atomic layer deposition and the electrical properties of Pt/SiC Schottky diodes with and without AlN layer were comparatively investigated. Based on the capacitance–voltage (C–V) and conductance–voltage (G/ω–V) characteristics, the interface state density decreased but the oxide trap density increased with an AlN layer. The border traps present near the AlN/SiC interface might produce such difference. Compared to the sample without AlN, both the barrier height and the ideality factor increased with an AlN. Analyses on the reverse leakage current density for Pt/AlN/SiC junction showed that the dominant transport mechanisms are ohmic conduction, trap assisted tunneling (TAT) and Fowler–Nordheim emissions at low, intermediate, and high electric field regions, respectively. Both the nitrogen vacancies and dangling bonds in Al in AlN layer were suggested to contribute to the TAT conduction. © 2018, The Korean Institute of Electrical and Electronic Material Engineers.
引用
收藏
页码:235 / 240
页数:5
相关论文
共 50 条
  • [41] Effect of heavy proton and neutron irradiations on epitaxial 4H-SiC Schottky diodes
    Sciortino, S
    Hartjes, F
    Lagomarsino, S
    Nava, F
    Brianzi, M
    Cindro, V
    Lanzieri, C
    Moll, M
    Vanni, P
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 2005, 552 (1-2): : 138 - 145
  • [42] Effect of plasma etching and sacrificial oxidation on 4H-SiC Schottky barrier diodes
    Morrison, D.J.
    Pidduck, A.J.
    Moore, V.
    Wilding, P.J.
    Hilton, K.P.
    Uren, M.J.
    Johnson, C.M.
    Materials Science Forum, 2000, 338
  • [43] Improving the barrier inhomogeneity of 4H-SiC Schottky diodes by inserting Al2O3 interface layer
    Shi, Ding-kun
    Wang, Ying
    Wu, Xue
    Yang, Zhao-yang
    Li, Xing-ji
    Yang, Jian-qun
    Cao, Fei
    Solid-State Electronics, 2021, 180
  • [44] Improving the barrier inhomogeneity of 4H-SiC Schottky diodes by inserting Al2O3 interface layer
    Shi, Ding-kun
    Wang, Ying
    Wu, Xue
    Yang, Zhao-yang
    Li, Xing-ji
    Yang, Jian-qun
    Cao, Fei
    SOLID-STATE ELECTRONICS, 2021, 180
  • [45] Fabrication and Characterization of Oxygenated AlN/4H-SiC Heterojunction Diodes
    Kim, Dong-Hyeon
    Min, Seong-Ji
    Oh, Jong-Min
    Koo, Sang-Mo
    MATERIALS, 2020, 13 (19) : 1 - 8
  • [46] MOVPE growth of N-polar AlN on 4H-SiC: Effect of substrate miscut on layer quality
    Lemettinen, J.
    Okumura, H.
    Kim, I.
    Kauppinen, C.
    Palacios, T.
    Suihkonen, S.
    JOURNAL OF CRYSTAL GROWTH, 2018, 487 : 12 - 16
  • [47] Annealing effects of Schottky contacts on the characteristics of 4H-SiC Schottky barrier diodes
    Kang, SC
    Kum, BH
    Do, SJ
    Je, JH
    Shin, MW
    WIDE-BANDGAP SEMICONDUCTORS FOR HIGH-POWER, HIGH-FREQUENCY AND HIGH-TEMPERATURE APPLICATIONS-1999, 1999, 572 : 141 - 146
  • [48] 4H-SiC Schottky diodes with high on/off current ratio
    Vassilevski, K.V., 1600, (Trans Tech Publications Ltd): : 389 - 393
  • [49] 4H-SiC Trench Schottky Diodes for Next Generation Products
    Zhang, Qingchun
    Duc, Jennifer
    Mieczkowski, Van
    Hull, Brett
    Allen, Scott
    Palmour, John
    SILICON CARBIDE AND RELATED MATERIALS 2012, 2013, 740-742 : 781 - 784
  • [50] Temperature dependent IBIC study of 4H-SiC Schottky diodes
    Vittone, E
    Rigato, V
    Olivero, P
    Nava, F
    Manfredotti, C
    LoGiudice, A
    Garino, Y
    Fizzotti, F
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2005, 231 : 491 - 496