Correction to: Study on Thermal Response of Adhesively Bonded Honeycomb Sandwich Structure in High Temperature

被引：0
|
作者：
Rongnan Yuan
Yi Zhang
Yiren Qin
Shouxiang Lu
机构：
[1] University of Science and Technology of China,State Key Laboratory of Fire Science
来源：
Fire Technology | 2022年 / 58卷
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
A correction to this paper has been published: https://doi.org/10.1007/s10694-021-01142-w
引用
收藏
页码：1067 / 1067
相关论文
共 50 条
  • [41] A new multifunctional carbon fiber honeycomb sandwich structure with excellent mechanical and thermal performances
    Zhao, Weikai
    Liu, Zhengxian
    Yu, Guocai
    Wu, Linzhi
    COMPOSITE STRUCTURES, 2021, 274
  • [42] RESEARCH ON PULSE INFRARED THERMAL WAVE DETECTION TECHNOLOGY FOR HONEYCOMB SANDWICH STRUCTURE DEFECTS
    Tang, Qing-Ju
    Gu, Zhuo-Yan
    Bu, Hong-Ru
    Xie, Rui
    THERMAL SCIENCE, 2024, 28 (02): : 1091 - 1099
  • [43] RESEARCH ON PULSE INFRARED THERMAL WAVE DETECTION TECHNOLOGY FOR HONEYCOMB SANDWICH STRUCTURE DEFECTS
    Tang, Qing-Ju
    Gu, Zhuo-Yan
    Bu, Hong-Ru
    Xie, Rui
    THERMAL SCIENCE, 2024, 28 (2A): : 1091 - 1099
  • [44] Sound transmission loss behavior of honeycomb sandwich plate structure under thermal loading
    Wang, Zhonglong
    Fu, Tao
    Li, Jiaxing
    MECHANICS OF ADVANCED MATERIALS AND STRUCTURES, 2024, 31 (26) : 8624 - 8634
  • [45] Experimental and numerical study for effective thermal conductivity of metallic honeycomb sandwich structures
    Yuan, Rongnan
    Lu, Shouxiang
    JOURNAL OF SANDWICH STRUCTURES & MATERIALS, 2021, 23 (08) : 3540 - 3557
  • [46] Numerical study on curing-induced residual stress and deformation of adhesively bonded sandwich structures of dissimilar materials
    Li, Jianjun
    Zhu, Wenfeng
    Li, Yuanhui
    Tang, Genglin
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2022, 120 (1-2): : 1189 - 1201
  • [47] The effect of adhesive fillet on mechanical performance of adhesively bonded corrugated sandwich structures: an experimental-numerical study
    Han, X.
    Akhmet, G.
    Zhang, W.
    Chao, Y. X.
    Jin, Y.
    Yu, Y.
    Hu, P.
    Ibraimov, A.
    JOURNAL OF ADHESION, 2020, 96 (05): : 515 - 537
  • [48] Numerical study on curing-induced residual stress and deformation of adhesively bonded sandwich structures of dissimilar materials
    Jianjun Li
    Wenfeng Zhu
    Yuanhui Li
    Genglin Tang
    The International Journal of Advanced Manufacturing Technology, 2022, 120 : 1189 - 1201
  • [49] Study on the thermal shock resistance of graphite components bonded with high temperature adhesives
    Wang, JG
    Guo, QG
    Liu, L
    Song, JR
    NEW CARBON MATERIALS, 2002, 17 (01) : 13 - 17
  • [50] Numerical Study of Transverse Impact Response of Single-lap Adhesively Bonded Joint
    Zhang, Jianguang
    Zhang, Zhen
    Ma, Dequan
    Wen, Yonghai
    Gong, Shaobo
    He, Xiaodong
    ADVANCED MATERIALS AND PROCESS TECHNOLOGY, PTS 1-3, 2012, 217-219 : 2154 - 2158
12345