Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

被引：0
|
作者：
Yee-Wen Yen
Da-Wei Liaw
Kuen-Da Chen
Hao Chen
机构：
[1] National Taiwan University of Science and Technology,Department of Materials Science and Engineering
[2] National Taiwan University of Science and Technology,Graduate Institute of Engineering
来源：
Journal of Electronic Materials | 2010年 / 39卷
关键词：
Interfacial reaction; Sn-58Bi; Sn-9Zn; Au/Ni/SUS304 multilayer substrate; diffusion controlled;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The liquid/solid interfacial reactions of Sn-58Bi (SB) and Sn-9Zn (SZ) lead-free solders with Au/Ni/SUS304 multilayer substrates have been investigated in this study. In the SB/Au/Ni/SUS304 couple, only the Ni3Sn4 phase with needle-like grains was formed at the SB/Au/Ni/SUS304 interface. The Ni5Zn21 phase with a column structure was formed at the SZ/Au/Ni/SUS304 interface. The thickness of both intermetallic compounds (IMCs) increased with increasing reaction temperature and time. Meanwhile, the growth mechanism of these two IMCs is seen to follow a parabolic law and is diffusion controlled.
引用
收藏
页码：2412 / 2417
页数：5
相关论文
共 50 条
  • [31] Effects of Ag on Properties of Sn-9Zn Lead-Free Solder
    Chen Wenxue
    Xue Songbai
    Wang Hui
    Hu Yuhua
    RARE METAL MATERIALS AND ENGINEERING, 2010, 39 (10) : 1702 - 1705
  • [32] Effects of Sulfur on the Properties of Sn-9Zn as Lead-Free Solder
    Xiuqin Wei
    Yinghui Li
    Huizhen Huang
    Journal of Electronic Materials, 2017, 46 : 1067 - 1071
  • [33] Interfacial reaction and growth behavior of IMCs layer between Sn-58Bi solders and a Cu substrate
    Hu, Xiaowu
    Li, Yulong
    Min, Zhixian
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2013, 24 (06) : 2027 - 2034
  • [34] Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates
    Kim, Seongjun
    Kim, Keun-Soo
    Suganuma, Katsuaki
    Izuta, Goro
    JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (06) : 873 - 883
  • [35] Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9Zn Lead-Free Solders Alloy
    Yang, Wenchao
    Mao, Jun
    Ma, Yueyuan
    Yu, Shuyuan
    He, Hongping
    Qi, Da
    Zhan, Yongzhong
    MATERIALS, 2021, 14 (10)
  • [36] Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates
    Seongjun Kim
    Keun-Soo Kim
    Katsuaki Suganuma
    Goro Izuta
    Journal of Electronic Materials, 2009, 38 : 873 - 883
  • [37] Inhibiting the growth of Sn whisker in Sn-9Zn lead-free solder by Nd and Ga
    Peng Xue
    Song-bai Xue
    Yi-fu Shen
    Hong Zhu
    Journal of Materials Science: Materials in Electronics, 2014, 25 : 2671 - 2675
  • [38] Inhibiting the growth of Sn whisker in Sn-9Zn lead-free solder by Nd and Ga
    Xue, Peng
    Xue, Song-bai
    Shen, Yi-fu
    Zhu, Hong
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 25 (06) : 2671 - 2675
  • [39] Effect of isothermal aging on room temperature impression creep of lead free Sn-9Zn and Sn-8Zn-3Bi solders
    Mahmudi, R.
    Geranmayeh, A. R.
    Noori, H.
    Khanbareh, H.
    Jahangiri, N.
    MATERIALS SCIENCE AND TECHNOLOGY, 2010, 26 (08) : 1001 - 1007
  • [40] The reliability study of selected Sn-Zn based lead-free solders on Au/Ni-P/Cu substrate
    Shiue, RK
    Tsay, LW
    Lin, CL
    Ou, JL
    MICROELECTRONICS RELIABILITY, 2003, 43 (03) : 453 - 463
12345