Si doping in Ge2Sb2Te5 film to reduce the writing current of phase change memory

被引:0
|
作者
J. Feng
Y. Zhang
B.W. Qiao
Y.F. Lai
Y.Y. Lin
B.C. Cai
T.A. Tang
B. Chen
机构
[1] Shanghai Jiao Tong University,National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, Institute of Micro/Nano Science and Technology
[2] Fudan University,State Key Laboratory of ASIC & System
[3] Silicon Storage Technology Inc,undefined
来源
Applied Physics A | 2007年 / 87卷
关键词
Joule Heat; Nitrogen Doping; High Resistance State; Phase Change Memory; Phase Change Mate;
D O I
暂无
中图分类号
学科分类号
摘要
The characteristics of phase change memory devices in size of several micrometers and with pure Ge2Sb2Te5 (GST), N-doped GST, and Si-doped GST films were investigated and compared with each other. The Si-doped GST device can perform SET and RESET cycles, even if the Si dopant is as small as 4.1 at. %. But the GST and N-doped GST device cannot perform the RESET process, though the SET state resistance of N-doped device is almost the same as that of Si-doped device and larger than that of GST device. In order to explain this phenomenon, the electrical and DSC characteristics of three kinds of films were investigated. Phase separation was found in Si-doped GST films. The reason of the RESET ability of Si-doped GST devices is supposed to be the existence of rich Si phases which act as micro-heaters. Thermal conduction simulations confirmed this supposition and indicate that the separated high resistance phase (rich Si phase) can heat the active volume of device efficiently and reduce the writing current largely.
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页码:57 / 62
页数:5
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