Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate

被引:0
|
作者
Yoshikazu Takaku
Komei Makino
Keita Watanabe
Ikuo Ohnuma
Ryosuke Kainuma
Yasushi Yamada
Yuji Yagi
Ikuo Nakagawa
Takashi Atsumi
Kiyohito Ishida
机构
[1] Tohoku University,CREST
[2] Tohoku University,JST, Department of Materials Science, Graduate School of Engineering
[3] Tohoku University,Department of Materials Science, Graduate School of Engineering
[4] Toyota Central R&D Laboratories,Institute of Multidisciplinary Research for Advanced Materials
[5] Inc.,undefined
[6] Toyota Motor Corporation,undefined
来源
Journal of Electronic Materials | 2009年 / 38卷
关键词
Zn-Al-Cu solder; Ni substrate; interfacial reaction; intermetallic compound; thermal cycling test;
D O I
暂无
中图分类号
学科分类号
摘要
The Zn-Al(-Cu) eutectic alloys (melting point 381°C) are candidates for use as Pb-free high-temperature solders as a substitute for Pb-based solders, which are suitable for severe working environments such as the engine room of hybrid vehicles equipped with an inverter system as well as a heat engine. In this study, the interfacial reaction between Zn-Al(-Cu) alloys and the Ni substrate during soldering, aging, and thermal cycling was investigated. Semiconductor chips and Ni substrates were soldered with Zn-Al(-Cu) alloys at various temperatures under a nitrogen atmosphere. The soldered assemblies were then heat-treated at 200°C and 300°C to examine the microstructural evolution at the soldered interface. The effect of severe thermal cycles between −40°C and 250°C in air on the microstructure and fracture behavior at the solder joint was investigated. Even after a 1000-cycle test, the thickness of the Al3Ni2 layer formed at the interface between the Zn-Al-based solder and the Ni substrate, which is responsible for the damage of the soldered assemblies, was quite small.
引用
收藏
页码:54 / 60
页数:6
相关论文
共 50 条
  • [41] Microstructure and interfacial reaction of Sn–Zn–x(Al,Ag) near-eutectic solders on Al and Cu substrates
    M. L. Huang
    X. L. Hou
    N. Kang
    Y. C. Yang
    Journal of Materials Science: Materials in Electronics, 2014, 25 : 2311 - 2319
  • [42] DEFORMATION OF NI-AL AT HIGH-TEMPERATURE
    LASALMONIE, A
    JOURNAL OF MATERIALS SCIENCE, 1982, 17 (08) : 2419 - 2423
  • [43] Correction to: Characteristics of eutectic and near-eutectic Zn–Al alloys as high-temperature lead-free solders
    Mohammad Mehedi Hasan
    Ahmed Sharif
    M. Abdul Gafur
    Journal of Materials Science: Materials in Electronics, 2021, 32 : 1339 - 1339
  • [44] Thermal Properties and Wetting Behavior of High Temperature Zn-Al-In Solders
    Tomasz Gancarz
    Janusz Pstruś
    Przemysław Fima
    Sylwia Mosińska
    Journal of Materials Engineering and Performance, 2012, 21 : 599 - 605
  • [45] Characteristics of eutectic and near-eutectic Zn-Al alloys as high-temperature lead-free solders
    Hasan, Mohammad Mehedi
    Sharif, Ahmed
    Gafur, M. Abdul
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 31 (02) : 1691 - 1702
  • [46] Role of minor Zn addition in the interfacial reaction between lead-free solders and Cu
    Yang, S. C.
    Kao, C. R.
    2007 INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, PROCEEDINGS OF TECHNICAL PAPERS, 2007, : 102 - 105
  • [47] Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C
    Chao-hong Wang
    Hsien-hsin Chen
    Journal of Electronic Materials, 2010, 39 : 2375 - 2381
  • [48] Electroless Ni-W-P Alloy as a Barrier Layer between Zn-based High Temperature Solders and Cu Substrates
    Liu, Li
    Zhou, Longzao
    Liu, Changqing
    2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1348 - 1353
  • [49] Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C
    Wang, Chao-Hong
    Chen, Hsien-Hsin
    JOURNAL OF ELECTRONIC MATERIALS, 2010, 39 (11) : 2375 - 2381
  • [50] Interfacial reactions between electroplated Ni-Zn alloy films and lead-free solders
    Chia, Pay Ying
    Haseeb, A. S. Md Abdul
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2013, 24 (09) : 3423 - 3429