Ready-to-transfer two-dimensional materials using tunable adhesive force tapes

被引:0
|
作者
Maki Nakatani
Satoru Fukamachi
Pablo Solís-Fernández
Satoshi Honda
Kenji Kawahara
Yuta Tsuji
Yosuke Sumiya
Mai Kuroki
Kou Li
Qiunan Liu
Yung-Chang Lin
Aika Uchida
Shun Oyama
Hyun Goo Ji
Kenichi Okada
Kazu Suenaga
Yukio Kawano
Kazunari Yoshizawa
Atsushi Yasui
Hiroki Ago
机构
[1] Kyushu University,Global Innovation Center (GIC)
[2] Nitto Denko Corporation,Interdisciplinary Graduate School of Engineering Sciences
[3] Institute for 2D Materials LLC.,Faculty of Engineering Sciences
[4] Kyushu University,Institute for Materials Chemistry and Engineering (IMCE)
[5] Kyushu University,Laboratory for Future Interdisciplinary Research of Science and Technology
[6] Kyushu University,Department of Electrical, Electronic, and Communication Engineering, Faculty of Science and Engineering
[7] Tokyo Institute of Technology,The Institute of Scientific and Industrial Research (ISIR
[8] Chuo University,SANKEN)
[9] Osaka University,Nanomaterials Research Institute
[10] National Institute of Advanced Industrial Science and Technology (AIST),undefined
[11] National Institute of Informatics,undefined
[12] Semiconductor R&D Center,undefined
[13] Samsung Electronics,undefined
来源
Nature Electronics | 2024年 / 7卷
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摘要
Graphene and other two-dimensional (2D) materials can be used to create electronic and optoelectronic devices. However, their development has been limited by the lack of effective large-area transfer processes. Here we report a transfer method that uses functional tapes with adhesive forces controlled by ultraviolet light. The adhesion of the tape is optimized for the transfer of monolayer graphene, providing a yield of over 99%. Once detached from the growth substrate, the graphene/tape stack enables easy transfer of graphene to the desired target substrate. The method can be used to transfer other 2D materials, including bilayer graphene, transition metal dichalcogenides, hexagonal boron nitride and stacked heterostructures. The solvent-free nature of the final release step facilitates transfer to various target substrates including flexible polymers, paper and three-dimensional surfaces. The tape/2D material stacks can also be cut into desired sizes and shapes, allowing site-selective device fabrication with reduced loss of 2D materials.
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页码:119 / 130
页数:11
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