Formation Mechanism of SiC in the Diffusion Couple Interface during the MG-Si Production Process

被引:0
|
作者
Dongling Liu
Xiaocong Deng
Jinsong Tai
Shicong Yang
Kuixian Wei
Wenhui Ma
机构
[1] Kunming University of Science and Technology,National Engineering Laboratory for Vacuum Metallurgy/Faculty of Metallurgical and Energy Engineering
[2] Kunming University of Science and Technology,State Key Laboratory of Complex Nonferrous Metal Resources Clean Utilization
来源
Silicon | 2022年 / 14卷
关键词
MG-Si production; Carbothermal reduction; Silicon carbide; Diffusion reaction;
D O I
暂无
中图分类号
学科分类号
摘要
SiC is an important intermediate product in the production process of metallurgical-grade silicon (MG-Si), and is of great significance for the improvement of the efficiency of MG-Si production. In this study, the formation mechanism of SiC is revealed via an experimental system of a silica-charcoal diffusion couple. The phase transition and microscopic characteristics of the contact interface of the diffusion couple indicate that SiC forms on the carbon side, while the silica side is eroded. The element distribution characteristics of the reaction cross-section reveal that SiC forms inside the carbon along the longitudinal direction. Via the combination of thermodynamic calculation and experimental analysis, the formation mechanisms of SiC on the surface and inside the carbon are confirmed; the SiC on the surface is formed by both one-step and two-step reactions, while the internal SiC is formed only by a two-step reaction. Moreover, increasing the temperature is found to be beneficial to the formation of SiC, and the thickness of the SiC layer increased from 130 to 135 μm with the increase of the temperature from 1673 K to 1773 K. SiO is found to be the key intermediate of the two-step reaction. The prevention of the escape of SiO has great significance for the reduction of the costs and the increase of the yield of MG-Si production.
引用
收藏
页码:11371 / 11380
页数:9
相关论文
共 50 条
  • [41] ON THE MECHANISM OF PORE FORMATION DURING DIFFUSION
    BRINKMAN, JA
    ACTA METALLURGICA, 1955, 3 (06): : 606 - 607
  • [42] In situ spectroscopic ellipsometry studies of the interaction process of ethene with Si surfaces during SiC formation
    Wöhner, T
    Stauden, T
    Cimalla, V
    Eichhorn, G
    Schaefer, JA
    Pezoldt, J
    IN SITU PROCESS DIAGNOSTICS AND MODELLING, 1999, 569 : 95 - 100
  • [43] STRUCTURE AND MECHANISM OF BONDING AT A DIFFUSION-BONDED AL/SIC INTERFACE
    RATNAPARKHI, PL
    HOWE, JM
    ACTA METALLURGICA ET MATERIALIA, 1994, 42 (03): : 811 - 823
  • [44] Formation of CaMgSi at Ca2Si/Mg2Si interface
    Hosono, T
    Kuramoto, A
    Matsuzawa, Y
    Momose, Y
    Maeda, Y
    Matsuyama, T
    Tatsuoka, H
    Fukuda, Y
    Hashimoto, S
    Kuwabara, H
    APPLIED SURFACE SCIENCE, 2003, 216 (1-4) : 620 - 624
  • [45] Microstructure and Property Evolution of an Al-Mg-Si Alloy Cable during the Production Process
    Liu, Min
    Miao, Yaojun
    Guo, Ziming
    Liu, Teng
    Peng, Peng
    Wang, Zhanyong
    Gao, Haiyan
    Sun, Baode
    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2024,
  • [46] Formation mechanism of a faceted interface: In situ observation of the Si(100) crystal-melt interface during crystal growth
    Tokairin, M.
    Fujiwara, K.
    Kutsukake, K.
    Usami, N.
    Nakajima, K.
    PHYSICAL REVIEW B, 2009, 80 (17)
  • [47] Molecular Dynamics Study on Crack Propagation in Al Containing Mg-Si Clusters Formed during Natural Aging
    Lee, Sangjun
    Kang, Heon
    Bae, Donghyun
    MATERIALS, 2023, 16 (02)
  • [48] Surface segregation during Si/Gen/Si(100) interface formation
    Lu, Z.H.
    Baribeau, J.-M.
    Lockwood, D.J.
    1600, American Inst of Physics, Woodbury, NY, USA (76):
  • [49] Microscopic mechanism of dipole layer formation at the pentacene/Si interface
    Jeong, Hojin
    Jung, Duk Yong
    Yeom, Han Woong
    PHYSICAL REVIEW B, 2008, 78 (07):
  • [50] Diffusion at Cu/Sn interface during sintering process
    Sánchez, F
    Bolarín, AM
    Tello, A
    Hernández, LE
    Bas, JA
    MATERIALS SCIENCE AND TECHNOLOGY, 2006, 22 (05) : 590 - 596