Construction of the Criterion for Using a Two-dimensional Thermal Conductivity Model to Describe the Stress–strain State of a Thin Plate Under the Thermal Shock

The paper describes the stress–strain state of a thin plate, which arises during a thermal shock. The central focus of this paper is on a thin plate with one rigidly restrained edge and three free edges. An initial boundary value problem is formulated using a one-dimensional thermal conductivity model. Based on this problem solution, criteria are constructed for using a two-dimensional thermal conductivity model for a more accurate description of the stress–strain state of the plate. The first part of the criteria was obtained from general considerations and is not related to the specifics of the problem being solved. The second part of the criteria takes into account this specificity and can be recommended for use in solving specific problems. The investigation results can be used to describe the stress–strain state of a thin plate under thermal shock.