Microstructure and Mechanical Performance of Cu-Sn-Ti-Based Active Braze Alloy Containing In Situ Formed Nano-Sized TiC Particles

A Cu-Sn-Ti-based active brazing filler alloy was in situ reinforced with nanosized TiC particles by adding different amounts of a cellulose nitride-based binder. The TiC particles emanate from a reaction of the Ti within the filler alloy with the carbon from the binder that does not decompose completely during heating. The correlation between the microstructure and mechanical performance was studied. In addition, the effect of different binder amounts on the shear strength and cutting performance of brazed diamond grains was studied in shear tests and single grain cutting tests. The results clearly show that the mechanical performance of the brazed diamond grains can be improved by the formation of TiC particles. This is attributed to particle strengthening of the filler alloy matrix as well as to the decreasing grain size and more homogeneous distribution of the (Cu,Sn)3Ti5 phase with increasing amount of binder.