Dynamic Recrystallization During High-Strain-Rate Tension of Copper

被引：0

作者：

Nooshin Mortazavi

Nicola Bonora

Andrew Ruggiero

Magnus Hörnqvist Colliander

机构：

[1] Chalmers University of Technology,Department of Physics

[2] University of Cassino and Southern Lazio,Civil and Mechanical Engineering

来源：

Metallurgical and Materials Transactions A | 2016年 / 47卷

关键词：

Shear Band; Dynamic Recrystallization; Recrystallization Texture; High Stack Fault Energy; Deformation Substructure;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Discontinuous dynamic recrystallization can occur during dynamic tensile extrusion of copper, which is subjected to uniaxial tensile strains of ~5 and strain rates up to 106 s−1 in the extruded section. Through high-resolution transmission Kikuchi diffraction, we show that nucleation occurs through subgrain rotation and grain boundary bulging at boundaries between 〈001〉 and 〈111〉 oriented grains. The observed nuclei consist of subgrains with a size of approximately 200 to 400 nm.

引用

页码：2555 / 2559

页数：4

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