Exchange bias studies of NiFe/FeMn/NiFe trilayer by ion beam etching

被引:0
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作者
V. K. Sankaranarayanan
D. Y. Kim
S. M. Yoon
C. O. Kim
C. G. Kim
机构
[1] Chungnam National University,Department of Materials Engineering & ReCAMM
[2] National Physical Laboratory,Microstructure Devices Group, Electronic Materials Division
关键词
Neural Network; Sharp Increase; Gradual Increase; Magnetization Measurement; Reverse Order;
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学科分类号
摘要
Effect of low energy ion beam etching on exchange bias in NiFe/FeMn/NiFe trilayer is investigated in multilayers prepared by rf magnetron sputtering. Stepwise etching and magnetization measurement of FeMn layer in an NiFe/FeMn bilayer show increase of bias as etching proceeds and FeMn thickness decreases. The bias show a maximum around 7 nm FeMn thickness and then fall sharply below 5 nm, broadly in line with the exchange bias variation at increasing FeMn thickness but in reverse order, particularly at low FeMn thickness. Progressive etching of top NiFe layer in the NiFe/FeMn/NiFe trilayer shows an initial gradual increase in bias followed by a sharp increase below 7 nm thickness of top NiFe layer, with a maximum at 2 nm thickness for both NiFe layers and greater bias for seed NiFe layer.
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页码:203 / 206
页数:3
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