Transfer of monolayer TMD WS2 and Raman study of substrate effects

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作者
Jerome T. Mlack
Paul Masih Das
Gopinath Danda
Yung-Chien Chou
Carl H. Naylor
Zhong Lin
Néstor Perea López
Tianyi Zhang
Mauricio Terrones
A. T. Charlie Johnson
Marija Drndić
机构
[1] University of Pennsylvania,Department of Physics and Astronomy
[2] University of Pennsylvania,Department of Electrical and Systems Engineering
[3] University of Pennsylvania,Department of Materials Science and Engineering
[4] The Pennsylvania State University,Department of Physics
[5] Center for 2-Dimensional and Layered Materials,Department of Materials Science and Engineering
[6] The Pennsylvania State University,Department of Chemistry
[7] The Pennsylvania State University,undefined
[8] The Pennsylvania State University,undefined
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A facile transfer process for transition metal dichalcogenide WS2 flakes is reported and the effect of the underlying substrate on the flake properties is investigated using Raman spectroscopy. The flakes are transferred from their growth substrate using polymethyl methacrylate (PMMA) and a wet etch to allow the user to transfer the flakes to a final substrate using a microscope and micromanipulator combined with semi-transparent Kapton tape. The substrates used range from insulators such as industry standard high-k dielectric HfO2 and “green polymer” parylene-C, to conducting chemical vapor deposition (CVD) grown graphene. Raman spectroscopy is used first to confirm the material quality of the transferred flakes to the substrates and subsequently to analyze and separate the effects arising from material transfer from those arising from interactions with the substrate. We observe changes in the Raman spectra associated with the interactions between the substrates in the flakes. These interactions affect both in-plane and out-of-plane modes in different ways depending on their sources, for example strain or surface charge. These changes vary with final substrate, with the strongest effects being observed for WS2 transferred onto graphene and HfO2, demonstrating the importance of understanding substrate interaction for fabrication of future devices.
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