Assessment of void growth models from porosity measurements in cold-drawn copper bars

被引:0
|
作者
T. Pardoen
F. Delannay
机构
[1] Des Matériaux et Procédés at Université Catholique De Louvain,the Département Des Sciences
关键词
Material Transaction; Stress Triaxiality; Void Growth; Void Volume Fraction; Void Coalescence;
D O I
暂无
中图分类号
学科分类号
摘要
This work investigates void growth in cold-drawn copper bars containing a fine dispersion of small inclusions at which voids nucleate. Using the Rice and Tracey (RT), the Gurson-Tvergaard (GT), and the Gurson-Leblond-Perrin (GLP) void growth models, a procedure is proposed for deriving the porosity distribution from density measurements on specimens sectioned from the neck of a tensile bar. This procedure allows identification of the parameters of the models. The effect of strain hardening on porosity evolution is analyzed by comparing the behavior of the material in the cold-drawn state (n≈0.1) and in the recrystallized state (n≈0.4). Inclusion dimensions and distributions were found to be identical in these two states. The parameter α of the RT model is found to depend on n, whereas the parameter q of the Gurson-type models does not vary with n. Numerical modeling of porosity variations in notched, round copper bars shows that both the parameter α and the parameter q in the GT model depend on the stress triaxiality in the recrystallized material, whereas the parameter q remains a constant in the GLP model. Accounting for the ellipsoidal void shapes and for the presence of the inclusion significantly affects the prediction of porosity variations.
引用
收藏
页码:1895 / 1909
页数:14
相关论文
共 50 条
  • [41] Comparative study of electrical and mechanical properties of fire-refined and electrolytically refined cold-drawn copper wires
    Mònica Martínez
    Ana I. Fernández
    Mercè Segarra
    Helena Xuriguera
    Ferran Espiell
    Núria Ferrer
    Journal of Materials Science, 2007, 42 : 7745 - 7749
  • [42] Allowance for internal microstresses and texture in evaluation of residual stresses in cold-drawn steel wires with micromechanical models
    Zolotorevsky, NY
    Zisman, AA
    ICOTOM 14: TEXTURES OF MATERIALS, PTS 1AND 2, 2005, 495-497 : 1505 - 1510
  • [43] Effects of annealing process on microstructure and electrical properties of cold-drawn thin layer copper cladding steel wire
    Li, Hongjuan
    Ding, Zhimin
    Fang, Jianfei
    Gao, Yang
    Sun, Chengxin
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 25 (11) : 5107 - 5113
  • [44] Comparative study of electrical and mechanical properties of fire-refined and electrolytically refined cold-drawn copper wires
    Martinez, Monica
    Fernandez, Ana I.
    Segarra, Merce
    Xuriguera, Helena
    Espiell, Ferran
    Ferrer, Nuria
    JOURNAL OF MATERIALS SCIENCE, 2007, 42 (18) : 7745 - 7749
  • [46] Effects of annealing process on microstructure and electrical properties of cold-drawn thin layer copper cladding steel wire
    Hongjuan Li
    Zhimin Ding
    Jianfei Fang
    Yang Gao
    Chengxin Sun
    Journal of Materials Science: Materials in Electronics, 2014, 25 : 5107 - 5113
  • [47] Arising the Buschinger effect during outfitted forming of bar products from cold-drawn steel
    Kurganskij Mashinostroitel'nyj Inst, Kurgan, Russia
    Stal', 1996, (04): : 49 - 50
  • [48] TEMPERATURE AND STRAIN RATE DEPENDENCE OF THE STRENGTH OF HEAVILY COLD-DRAWN COPPER, NIOBIUM AND CU-20-PERCENT-NB
    SPITZIG, WA
    REED, LK
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1989, 111 : L13 - L17
  • [49] COMPARISON OF THE LOW-CYCLE FATIGUE PROPERTIES OF HEAVILY COLD-DRAWN COPPER AND CU-20-PERCENT-NB
    SPITZIG, WA
    REED, LK
    CHATTERJEE, A
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1990, 123 (01): : 69 - 74
  • [50] A COMPARISON OF THE MEASUREMENTS OF INTERNAL STRESSES IN COLD DRAWN TUBES AND BARS BY X-RAY AND BY MECHANICAL METHODS
    BOLLENRATH, F
    HAUK, V
    OHLY, W
    ZEITSCHRIFT FUR METALLKUNDE, 1964, 55 (11): : 655 - 659