Future of Packaging and packaging materials

被引：0

作者：

Tummala, Rao

Wong, C. P.

Qu, Jianmin

Sitaraman, Suresh

Raj, P. Markondeva

机构：

来源：

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：57 / 57

页数：1

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