Future of Packaging and packaging materials

被引：0
|
作者：
Tummala, Rao
Wong, C. P.
Qu, Jianmin
Sitaraman, Suresh
Raj, P. Markondeva
机构：
来源：
IEEE CPMT: International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces | 2006年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：57 / 57
页数：1
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