Influences of the moisture absorption on PBGA package's warpage during IR reflow process

被引：13

作者：

Chien, CH ^{[1
]}

Chen, YC

Chiou, YT

Chen, TP

Hsieh, CC

Yan, JJ

Chen, WZ

Wu, YD

机构：

[1] Natl Sun Yat Sen Univ, Dept Mech & Electromech Engn, Kaohsiung 80424, Taiwan

[2] Natl Pingtung Univ Sci & Technol, Dept Vehicle Engn, Pingtung 91241, Taiwan

[3] Ind Technol Res Inst, Mat Res Labs, Hsinchu 31040, Taiwan

[4] Fortune Inst Technol, Dept Elect Engn, Kaohsiung 84241, Taiwan

来源：

MICROELECTRONICS RELIABILITY | 2003年 / 43卷 / 01期

关键词：

D O I：

10.1016/S0026-2714(02)00283-4

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The coefficient of temperature expansion mismatch between materials in a thin plastic ball grid array package is primarily attributed to the warpage when mounting the package to a printed circuit board, especially when the moisture concentration reaches a specified value. The influence of variations in storage conditions on warpage was investigated in this paper. The effects of the reflow parameters on warpage were also examined. Taguchi's method was implemented for experimental design and data analyses. A critical relative moisture absorption between 0.25% and 0.30% was found for a considerable warpage response. (C) 2002 Elsevier Science Ltd. All rights reserved.

引用

页码：131 / 139

页数：9

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