Enhancing Low-Temperature and Pressureless Sintering of Micron Silver Paste Based on an Ether-Type Solvent

Micron silver paste enables a low-temperature and pressureless sintering process by using an ether-type solvent CELTOL-IA (C (x) H (y) O (z) , x > 10, boiling point of approximately 200A degrees C) for the die attachment of high-powered devices. The conductive patterns formed by the silver paste had a low electrical resistivity of 8.45 mu Omega cm at 180A degrees C. The paste also achieved a high bonding strength above 30 MPa at 180A degrees C without the assistance of pressures. These superior performance indicators result from the favorable removal of the solvent, its thermal behavior, and its good wetting on the silver layer. The results suggest that the micron silver paste with a suitablea solvent pound can promote the further spreading of next-generation power devices owing to its marked cost advantage and excellent performance.