Experimental and theoretical analysis of enhanced flat miniature heat pipes

A combined experimental and analytical study is realized to verify the miniature heat pipe (MHP) concept for cooling high-power dissipation electronic components and determine the potential advantages of constructing arrays of miniature channels as an integrated part of a heat pipe. A theoretical model is developed to predict the capillary limit and the thermal resistance of the flat MHP (FMHP). The model includes flow analysis and thermal study of the heat transfer modes in the capillary structures. To verify the mixed capillary structure concept and validate the proposed analytical model, an FMHP including a mixed capillary structure, rectangular grooves and screen wick, is manufactured, and a filling apparatus is developed charge such FMHPs. The heat transfer improvement obtained by comparing the heat pipe thermal resistance to the heat conduction thermal resistance of a copper plate having the same dimensions as the tested heat pipe is demonstrated for different heat input flux rates.