Atomistic simulation and experimental investigation of ultra precision cutting processes

Typical applications for components and equipment with extreme quality requirements regarding surface roughness, shape accuracy and integrity of the generated surface structure can be found in optical and semiconductor industry. Ultra precision machine tools equipped with sharp, single crystalline diamond provide the necessary machining accuracy. Here the actual cutting process can take place at atomic level, which makes the acquisition of typical cutting process data difficult or impossible. However a detailed characterization and understanding of the process is vital for its effective control as well as for further tool and process development. Therefore an approach is made that focuses on linking results from atomistic simulations with results and observations from cutting experiments. In this work the potential of molecular dynamics (MD) modeling for studying phenomena related to ultra precision cutting processes will be demonstrated. Observations and first results for machining copper will be presented.