Heterogeneously Integrated W-Band Downconverter

被引:6
|
作者
Radisic, Vesna [1 ]
Scott, Dennis W. [2 ]
Loi, K. K. [2 ]
Monier, Cedric [2 ]
Lai, Richard [2 ]
Gutierrez-Aitken, Augusto [2 ]
机构
[1] Northrop Grumman Corp, NG Next, Redondo Beach, CA 90278 USA
[2] Northrop Grumman Corp, Microelect, Redondo Beach, CA 90278 USA
关键词
3-D integration; double-balanced mixer; downconverter; heterogeneous integration; heterojunction bipolar transistor (HBT); high-electron-mobility transistor (HEMT); star mixer;
D O I
10.1109/LMWC.2017.2724001
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report a heterogeneously integrated W-band downconverter, consisting of a low noise amplifier (LNA) and a star mixer. An LNA is realized in a 0.1-mu m InP high-electron-mobility transistor (HEMT) technology and features the noise figure of similar to 2.5 dB and gain >= 25 dB at W-band. Star mixer is realized in four-layer interconnect InP heterojunction bipolar transistor (HBT) and diode process. A novel design eliminates electrically large diode ring by utilizing a multimetal configuration. Mixer chiplet is integrated into the LNA carrier wafer using heterogeneous integration, which offers electrically short connection between two technologies. Heterogeneously integrated interconnect or transition has measured a loss of similar to 0.8 dB up to 96 GHz. Integrated W-band downconverter has measured the conversion gain >= 0 dB from 87 to 100 GHz. This is a first reported integration of InP HBT chiplets into the InP HEMT wafer using heterogeneous integration, as well as first reported a W-band heterogeneously integrated downconverter.
引用
收藏
页码:739 / 741
页数:3
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