Peritectic Coupled Growth Solidification-a Review

被引:1
|
作者
Shahbeigi-Roodposhti, Peiman [1 ]
Brody, Harold [1 ]
机构
[1] Univ Connecticut, Storrs, CT 06269 USA
来源
关键词
Peritectic reaction; Coupled growth; Isothermal growth; FE-NI ALLOYS; DIRECTIONAL SOLIDIFICATION; MICROSTRUCTURE SELECTION; SYSTEM; TRANSFORMATION;
D O I
10.1007/978-3-319-51541-0_125
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
Initiation and growth mechanisms of peritectic coupled growth (PCG) structures have been reviewed to clarify parameters that play a significant role in PCG formation and stability. Three important alloys of Fe-Ni, Ni-Al and Ti-Al have been studied to reveal mechanisms contributing to PCG formation. Types of PCG, the stability of lamellar coupled growth and their morphological behavior are strongly dependent on G/V ratio (G: thermal gradient, V: growth rate), lamellar spacing and composition. Analogy between peritectic coupled growth (PCG) and eutectic coupled growth (ECG) is also a point of interest in this study. Further investigations in Ni-Al and Cu-Sn are necessary to clarify the PCG formation (nucleation/growth mechanism) in conventional G/V versus composition diagram.
引用
收藏
页码:1035 / 1041
页数:7
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