Thermal challenges in next generation electronic systems

被引：12
|
作者：
Joshi, YK [1 ]
Garimella, SV
机构：
[1] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA
[2] Purdue Univ, Sch Mech Engn, Cooling Technol Res Ctr, NSF I UCRC, W Lafayette, IN 47907 USA
来源：
MICROELECTRONICS JOURNAL | 2003年 / 34卷 / 03期
关键词：
D O I：
10.1016/S0026-2692(02)00184-2
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：169 / 169
页数：1
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