Surface metallization with Ni-Cu bimetal for ZTA by electroless plating

被引:3
|
作者
He, Han [1 ,2 ]
Jiang, Yehua [1 ,2 ]
Ru, Juanjian [3 ]
Zhou, Rong [1 ,2 ]
Hua, Yixin [3 ]
机构
[1] Kunming Univ Sci & Technol, Sch Mat Sci & Engn, Kunming, Yunnan, Peoples R China
[2] Natl & Local Joint Engn Lab Adv Met Solidificat F, Kunming, Yunnan, Peoples R China
[3] Kunming Univ Sci & Technol, Fac Met & Energy Engn, Kunming, Yunnan, Peoples R China
基金
中国国家自然科学基金;
关键词
Surface metallization; ZTA particles; Ni– Cu bimetallic coatings; electroless plating; ionic liquid additive; DEEP EUTECTIC SOLVENTS; PARTICLES; NICKEL; IRON; CAST;
D O I
10.1080/09276440.2021.1913899
中图分类号
TB33 [复合材料];
学科分类号
摘要
The surface metallization of zirconia-toughened alumina (ZTA) particles with Ni-Cu bimetallic coatings is performed by electroless plating assisted with choline chloride-ethylene glycol (ChCl-EG) ionic liquid. The possible reactions and deposition sequences of the plating process have been analyzed based on the micro-morphologies of the Ni-Cu coated ZTA (ZTA@Ni-Cu) particles obtained at different reaction stages. The roles of ChCl-EG additive, reaction temperature, and ZTA concentration on the surface morphology, coating thickness, and element content of the ZTA@Ni-Cu particles are also investigated. Results show that uniform cauliflower-characteristic Ni-Cu coatings are formed on ZTA surfaces with 35 g center dot L-1 ChCl-EG at 65 degrees C. The coating thickness is about 26.9 mu m, and the element contents of Cu and Ni are 38.1 at% and 61.9 at%, respectively. Besides, a schematic illustration about the fabrication of ZTA@Ni-Cu particles is proposed to elaborate the formation process of Ni-Cu coatings and the function mechanism of ChCl-EG additive.
引用
收藏
页码:161 / 174
页数:14
相关论文
共 50 条
  • [41] Improvement of electrocatalytic activity of bimetal sulfide of Ni-Cu by α-MnO2 for methanol oxidation
    Mardani Z.
    Bagher Gholivand M.
    Journal of Electroanalytical Chemistry, 2022, 923
  • [42] Improvement of Corrosion Behavior of the Cu-Ni Alloy with Electroless Ni-P plating
    Li Qing-fen
    Fu Yu-dong
    Wang Hai-dou
    Wang Jun
    ADVANCES IN FRACTURE AND DAMAGE MECHANICS VIII, 2010, 417-418 : 29 - +
  • [43] Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal
    Zhao, Jia-lei
    Jie, Jin-chuan
    Chen, Fei
    Chen, Hang
    Li, Ting-ju
    Cao, Zhi-qiang
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2014, 24 (06) : 1659 - 1665
  • [44] The electroless plating of Cu-Ni-P alloy onto cotton fabrics
    Afzali, Arezoo
    Mottaghitalab, Vahid
    Motlagh, Mahmood Saberi
    Haghi, Akbar Khodaparast
    KOREAN JOURNAL OF CHEMICAL ENGINEERING, 2010, 27 (04) : 1145 - 1149
  • [45] Study of electroless Ni-Cu-P alloy plating on the glass fiber
    Dept. of Applied Chemistry, School of Science, Northwestern Polytechnical University, Xi'an 710072, China
    Cailiao Kexue yu Gongyi, 2006, 6 (630-632+636):
  • [46] CERAMIC METALLIZATION USING MOLTEN-SALT AND ELECTROLESS PLATING
    IACOVANGELO, CD
    JERABEK, EC
    KING, RN
    PLATING AND SURFACE FINISHING, 1994, 81 (01): : 54 - 59
  • [47] The electroless plating of Cu-Ni-P alloy onto cotton fabrics
    Arezoo Afzali
    Vahid Mottaghitalab
    Mahmood Saberi Motlagh
    Akbar Khodaparast Haghi
    Korean Journal of Chemical Engineering, 2010, 27 : 1145 - 1149
  • [48] CRYSTALLIZATION OF AMORPHOUS NI-CU-B ALLOYS OBTAINED BY ELECTROLESS PLATING
    HU, WY
    WU, LJ
    WANG, LL
    ZHANG, BW
    GUAN, HR
    PHYSICA B, 1995, 212 (02): : 195 - 200
  • [49] Metallization of electrospun PAN nanofibers via electroless gold plating
    Yadav, Ramdayal
    Balasubramanian, K.
    RSC ADVANCES, 2015, 5 (32) : 24990 - 24996
  • [50] Interfacial reactions on electrolytic Ni and electroless Ni(P) metallization with Sn-In-Ag-Cu solder
    Sharif, A
    Chan, YC
    JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 393 (1-2) : 135 - 140