Aging resistance of the Sn-Ag-Cu solder joints doped with Mo nanoparticles

被引：20
|
作者：
Yang, Linmei [1 ]
Quan, Shanyu [1 ]
Liu, Cong [1 ]
Shi, Guimei [1 ]
机构：
[1] Shenyang Univ Technol, 111 Shenliaoxi Rd, Shenyang 110870, Liaoning, Peoples R China
来源：
MATERIALS LETTERS | 2019年 / 253卷
基金：
中国国家自然科学基金;
关键词：
Interfaces; Aging; Diffusion; Intermetallic compounds; Mo nanoparticles; IMC GROWTH; INTERMETALLIC COMPOUND; INTERFACIAL REACTION; NI; MICROSTRUCTURE; TEMPERATURE; SUBSTRATE; BEHAVIOR;
D O I：
10.1016/j.matlet.2019.06.068
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The influences of Mo nanoparticles on the growth of intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints during aging were investigated. The results reveal that Mo nanoparticles can significantly refine Ag3Sn grains and inhibit Cu6Sn5 layer thickening, which is very beneficial to the reliability of solder joints. The aging resistance originated from Mo nanoparticles is explained by diffusion theory. (C) 2019 Elsevier B.V. All rights reserved.
引用
收藏
页码：191 / 194
页数：4
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