Flip-chip integrated optical wireless transceivers

被引：2

作者：

O'Brien, DC ^{[1
]}

Faulkner, GE ^{[1
]}

Zyambo, EB ^{[1
]}

Edwards, DJ ^{[1
]}

Stavrinou, P ^{[1
]}

Parry, G ^{[1
]}

Bellon, J ^{[1
]}

Sibley, MJ ^{[1
]}

Lalithambika, VA ^{[1
]}

Joyner, VM ^{[1
]}

Samsudin, RJ ^{[1
]}

Holburn, DM ^{[1
]}

Mears, RJ ^{[1
]}

机构：

[1] Univ Oxford, Dept Engn Sci, Oxford OX1 3PJ, England

来源：

OPTICAL WIRELESS COMMUNICATIONS V | 2002年 / 4873卷

关键词：

optical wireless; resonant cavity LED; flip-chip bonding; CMOS;

D O I：

10.1117/12.455519

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The widespread use of Optical LANs is dependent on the ability to fabricate low cost transceiver components. These are usually complex, and fabrication involves the integration of optoelectronic and electronic devices, as well as optical components. A consortium of four UK universities are currently involved in a project to demonstrate integrated optical wireless transceiver subsystems that can provide eye-safe line of sight in-building communication at 155Mbit/s and above. In this paper we discuss the flip-chip integration of two-dimensional arrays of novel microcavity LEDs with custom CMOS integrated circuits in order to produce solid state tracking emitters. Design, fabrication and integration of these structures are detailed. The scaleability and future capability available given further optimisation and development of these systems is also discussed.

引用

页码：23 / 29

页数：7

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