XPS study of CMP mechanisms of NiP coating for hard disk drive substrates

被引:50
|
作者
Qi, Zuqiang [1 ]
Lee, Weiming [1 ]
机构
[1] Shenzhen Kaifa Magnet Recording Co Ltd, R&D Dept, Shenzhen 518035, Peoples R China
关键词
Chemical mechanical polishing (CMP); X-ray photoelectron spectroscope (XPS); Passivation; SILICA SLURRY; NICKEL; PLANARIZATION; OXIDATION; BEHAVIOR; FILMS; WATER; METAL; MODEL;
D O I
10.1016/j.triboint.2009.11.007
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Chemical mechanical polishing (CMP) mechanisms of NiP coating plated on Al-Mg alloy substrates have been investigated with an X-ray photoelectron spectroscope (XPS). The XPS results indicate that after cleaning, the disk surface contains a thin layer of Ni(CH)(2) and P2O3, followed by a thin NiO and P2O3 layer. It is also deduced that during polishing, the disk surface has an oxidization layer with Ni2+ and p(3+) species. The experimental investigations reveal that the CMP mechanisms involve a simultaneous process of surface chemical passivation and nano-particle wear. (C) 2009 Elsevier Ltd. All rights reserved.
引用
收藏
页码:810 / 814
页数:5
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