Optimization and Fabrication of MEMS suspended structures for nanoscale thermoelectric devices

被引：6

作者：

Wei, Lei ^{[1
,4
]}

Wei, Jiangtao ^{[1
]}

Kuai, Xuebao ^{[1
]}

You, Zhiwei ^{[1
,2
,3
]}

Zhang, Mingliang ^{[1
,4
]}

Liu, Wen ^{[1
]}

Yang, Fuhua ^{[1
,4
,5
]}

Wang, Xiaodong ^{[1
,2
,3
,5
,6
]}

机构：

[1] Chinese Acad Sci, Engn Res Ctr Semicond Integrated Technol, Inst Semicond, Beijing 100083, Peoples R China

[2] Univ Chinese Acad Sci, Sch Microelect, Beijing 100049, Peoples R China

[3] Univ Chinese Acad Sci, Ctr Mat Sci & Optoelect Engn, Beijing 100049, Peoples R China

[4] Univ Chinese Acad Sci, Coll Mat Sci & Optoelect Technol, Beijing 100049, Peoples R China

[5] Beijing Acad Quantum Informat Sci, Beijing 100193, Peoples R China

[6] Beijing Engn Res Ctr Semicond Micronano Integrate, Beijing 100083, Peoples R China

来源：

NANOTECHNOLOGY | 2022年 / 33卷 / 32期

关键词：

thermoelectric; MEMS suspended devices; Si nanomaterials; stress; THERMAL-CONDUCTIVITY; 3-OMEGA METHOD; STRAIN; TRANSPORT; NANOWIRES;

D O I：

10.1088/1361-6528/ac667a

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

By eliminating the influence of the substrate on parasitic thermal resistance, MEMS suspended structures become one of the accurate nanoscale thermoelectric performance evaluation devices. However, the process of MEMS suspended thermoelectric devices is complex, and its multilayer suspended structure is easy to fracture due to large stress. As a result, optimizing the design of suspended structures is critical in order to reduce manufacturing complexity and increase yield. In this study, finite element simulation is used to investigate the impacts of varying structures and sizes on the stress of MEMS suspended devices. The maximum stress and average stress of silicon nanomaterials are lowered by 90.89% and 92.35%, respectively, by optimizing the structure and size of the beams and nanobelt. Moreover, MEMS suspended devices of various structures are successfully manufactured. It not only increases the yield to more than 70% but also decreases the impact of strain on thermoelectric performance and can be used to create suspended devices with integrated silicon microstrips.

引用

页数：10

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