Relation between deposition and recrystallization textures of copper and chromium electrodeposits

The < 100 >, < 111 >, and < 110 > textures of copper electrodeposits obtained from copper sulfate baths changed to the < 100 > < 100 >, and <root 310 > textures, respectively, after recrystallization. However, a duplex deposition texture consisting of < 111 > and < 110 > changed to the <root 310 > texture after recrystallization. The textures of chromium electrodeposits obtained from the standard Sargent bath remained unchanged after recrystallization. The results are in agreement with the prediction of the strain energy release maximization model, in which the recrystallized grains orient themselves so that their minimum elastic modulus direction can be parallel to the absolute maximum internal stress direction due to dislocations in the non-recrystallized grains.