Ultrathin film Si-based circuits fabricated on polyimide substrate

被引：0
|
作者：
不详
机构：
来源：
MRS BULLETIN | 1998年 / 23卷 / 04期
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：4 / 4
页数：1
相关论文
共 50 条
  • [21] Flexible piezoelectric cantilevers fabricated on polyimide substrate
    Petroni, S.
    Maruccio, G.
    Guido, F.
    Amato, M.
    Campa, A.
    Passaseo, A.
    Todaro, M. T.
    De Vittorio, M.
    MICROELECTRONIC ENGINEERING, 2012, 98 : 603 - 606
  • [22] Surface-barrier Si-based photodetectors fabricated by the spray pyrolysis technique
    Malik, A
    Vieira, M
    Fernandes, M
    PHILOSOPHICAL MAGAZINE B-PHYSICS OF CONDENSED MATTER STATISTICAL MECHANICS ELECTRONIC OPTICAL AND MAGNETIC PROPERTIES, 2000, 80 (04): : 781 - 790
  • [23] A study on thermal-stress-reliability of Si-based PLC substrate
    Kitazawa, I
    Mino, S
    Hibino, Y
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1997, 20 (03): : 327 - 333
  • [24] Magnetization processes in ultrathin Co film grown on stepped Si(111) substrate
    Stupakiewicz, Andrzej
    Fleurence, A.
    Maziewski, A.
    Maroutian, T.
    Gogol, P.
    Bartenlian, B.
    Mégy, R.
    Beauvillain, P.
    IEEE Transactions on Magnetics, 2008, 44 (11 PART 2) : 2887 - 2890
  • [25] Magnetization Processes in Ultrathin Co Film Grown on Stepped Si(111) Substrate
    Stupakiewicz, Andrzej
    Fleurence, A.
    Maziewski, A.
    Maroutian, T.
    Gogol, P.
    Bartenlian, B.
    Megy, R.
    Beauvillain, R.
    IEEE TRANSACTIONS ON MAGNETICS, 2008, 44 (11) : 2887 - 2890
  • [26] Thin-Film Polyimide Membrane Actuators Fabricated by Etching a Substrate by DRIE (Bosch Process)
    Imai, Satomitsu
    Shimizu, Yusuke
    Matsuno, Shingo
    JOURNAL OF ADVANCED MECHANICAL DESIGN SYSTEMS AND MANUFACTURING, 2012, 6 (02): : 287 - 295
  • [27] Hydrogenated amorphous silicon thin film transistor fabricated on glass and polyimide substrate at 200°C
    Huang, Jung-Jie
    Lee, Min-Hung
    Tsai, Cheng-Ju
    Yeh, Yung-Hui
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2007, 46 (3B): : 1295 - 1298
  • [28] An Overview of Challenges and Current Status of Si-based Terahertz Monolithic Integrated Circuits
    Rieh, Jae-Sung
    Oh, Yongho
    Yoon, Daekeun
    Kim, Namhyung
    Kim, Dong-Hyun
    Yun, Jongwon
    Kim, Hyunchul
    Song, Kiryong
    2012 IEEE 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT-2012), 2012, : 176 - 179
  • [29] A Wilkinson power divider on a low resistivity Si substrate with a polyimide interface layer for wireless circuits
    Papapolymerou, J
    Ponchak, GE
    Tentzeris, EM
    2002 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, DIGEST OF PAPERS, 2002, : 483 - 486
  • [30] A Wilkinson power divider on a low resistivity Si substrate with a polyimide interface layer for wireless circuits
    Papapolymerou, J
    Ponchak, GE
    Tentzeris, EM
    2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2002, : 593 - 596
12345