Shear horizontal guided wave modes to infer the shear stiffness of adhesive bond layers

This paper presents a non-destructive, ultrasonic technique to evaluate the quality of bonds between substrates. Shear-horizontally polarized (SH) wave modes are investigated to infer the shear stiffness of bonds, which is necessarily linked to the shear resistance that is a critical parameter for bonded structures. Numerical simulations are run for selecting the most appropriate SH wave modes, i.e., with higher sensitivity to the bond than to other components, and experiments are made for generating-detecting pre-selected SH wave modes and for measuring their phase velocities. An inverse problem is finally solved, consisting of the evaluation of the shear stiffness modulus of a bond layer at different curing times between a metallic plate and a composite patch, such assembly being investigated in the context of repair of aeronautical structures.