Process monitoring methodology using in-line parametric test

The relentless demand for consumer electronics products with more functions in smaller sizes is driving semiconductor manufacturers to fabricate smaller devices at shrinking process nodes. These smaller geometries coupled with new materials and process steps can generate new types of electrical device flaws during the total fabrication process. An alternative approach to in-line parametric metrology that leverages wafer probe card technology to take direct electrical measurements on product wafers will be necessary to ensure reasonable cost-of-test.