A novel contact resistance model of anisotropic conductive film for FPD packaging

被引：0

作者：

Wang, Gou-Jen ^{[1
]}

Lin, Yi-Chin ^{[1
]}

Lin, Gwo-Sen ^{[2
]}

机构：

[1] Natl Chung Hsing Univ, Dept Mech Engn, Taichung, Taiwan

[2] Wintek Inc, Taichung, Taiwan

来源：

DTIP 2006: SYMPOSIUM ON DESIGN,TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS 2006 | 2006年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this research, a novel contact resistance model for the flat panel display (FPD) packaging based on the within layer parallel and between layers series resistance concepts was proposed. The FJ2530 anisotropic conductive films (ACF) by Sony Inc. containing the currently smallest 3 mu m conductive particles was used to conduct the experiments to verify the accuracy of the proposed model. Calculated resistance of the chip-on-glass (COG) packaging by the proposed model is 0.163 Omega. It is found that the gold bump with 0.162 Omega resistance play the major role of the overall resistance. Although the predicted resistance by the proposed model is only one third of the experimentally measured value, it has been three-fold improvement compared to the existing models.

引用

页码：105 / +

页数：2

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