Enhanced Lumen Output of LEDs With Die Bonding by Printable Adhesive

被引：0
|
作者：
Shih, Yu-Chou [1 ]
You, Jiun-Pyng [1 ,2 ]
Shi, Frank G. [1 ]
机构：
[1] Univ Calif Irvine, Dept Chem Engn & Mat Sci, Irvine, CA 92697 USA
[2] Optobond Inc, Res & Dev Dept, Tai An 273100, Shandong, Peoples R China
来源：
IEEE PHOTONICS TECHNOLOGY LETTERS | 2017年 / 29卷 / 13期
关键词：
Die attach adhesive; light emitting diodes; mid-power LED; reflective DAA; silicone; ARRAYS;
D O I：
10.1109/LPT.2017.2703640
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A novel printable optically reflective adhesive is introduced to replace optically transparent adhesives for the die bonding of standard mesa type light-emitting diodes (LEDs). The new adhesive shows much lower thermal resistance than the optically transparent ones, and the printed adhesive layer also shows low fillet coverage around the chip, eliminating the absorption due to the surrounding die attach adhesive materials. The improvement in optical output by using printable optically reflective adhesive is found to be 2.3% points over standard adhesive with 33% fillet coverage. This letter suggests a cost-effective and speedy manufacturing method for mid-power mesa type LEDs, as well as chip-on-board packaging with multiple LED chips.
引用
收藏
页码：1109 / 1111
页数：3
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