Integration of Nanomaterials into Three-Dimensional Vertical Architectures

被引:2
|
作者
Wang, Jiaying [1 ,2 ,3 ]
Wagner, Stefan [6 ,7 ]
Chen, Wenjun [2 ,3 ,4 ]
Shi, Yuesong [4 ]
Ndao, Abdoulaye [5 ]
Li, Leon [1 ]
Kante, Boubacar [5 ]
Sirbuly, Donald [1 ,4 ]
Lemme, Max C. [6 ,7 ]
Vazquez-Mena, Oscar [1 ,2 ,3 ,4 ]
机构
[1] Univ Calif San Diego, Dept NanoEngn, 9500 Gilman Dr, La Jolla, CA 92093 USA
[2] Univ Calif San Diego, Ctr Memory & Recording Res, 9500 Gilman Dr, La Jolla, CA 92093 USA
[3] Univ Calif San Diego, Calibaja Ctr Resilient Mat & Syst, 9500 Gilman Dr, La Jolla, CA 92093 USA
[4] Univ Calif San Diego, Mat Sci & Engn, 9500 Gilman Dr, La Jolla, CA 92093 USA
[5] Univ Calif San Diego, Dept Elect & Comp Engn, 9500 Gilman Dr, La Jolla, CA 92093 USA
[6] Rhein Westfal TH Aachen, Chair Elect Devices, Otto Blumenthal Str 25, D-52074 Aachen, Germany
[7] AMO GmbH, Adv Microelect Ctr Aachen, Otto Blumenthal Str 25, D-52074 Aachen, Germany
关键词
three-dimensional vertical architecture; suspended graphene; silicon nitride thin film; nanomaterial integration; plasmon resonance; BUILDING-BLOCKS; DATA-STORAGE; GRAPHENE; SUPERCAPACITORS; MICROFABRICATION; LITHOGRAPHY; MEMBRANE; SENSORS;
D O I
10.1021/acsami.8b09813
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A novel layer-by-layer three-dimensional (3D) architecture allowing one to expand device fabrication in the vertical direction and integrating functional nanomaterials is presented by emulating civil engineering. The architecture uses SU-8 pillars as structural columns, which support multiple horizontal suspended thin films. The films then serve as platforms for the integration of nanomaterials and nanodevices. Multiple graphene layers suspended across SU-8 pillars with precise control on their vertical spacing are demonstrated. In addition to graphene, silicon nitride films that offer high strength yield and thickness control are also presented. Metallic microstructures, plasmonic nanostructures, semiconducting quantum dots, and monolayer graphene on the suspended films are achieved to prove the capability of integrating functional nanomaterials. This work provides the potential to integrate highly compact micro/nanoscale devices at different vertical levels with high surface density, which allows for more capabilities and functionalities in a single device.
引用
收藏
页码:28262 / 28268
页数:7
相关论文
共 50 条
  • [21] Three-Dimensional Printing of Hierarchical Porous Architectures
    Huang, Jen-Yu
    Xu, Hong
    Peratz, Eliad
    Wu, Dung-Yi
    Ober, Christopher K.
    Hanrath, Tobias
    CHEMISTRY OF MATERIALS, 2019, 31 (24) : 10017 - 10022
  • [22] Switch box architectures for three-dimensional FPGAs
    Gayasen, Aman
    Vijaykrishnan, N.
    Kandemir, Mahmut
    Rahman, Arif
    FCCM 2006: 14TH ANNUAL IEEE SYMPOSIUM ON FIELD-PROGRAMMABLE CUSTOM COMPUTING MACHINES, PROCEEDINGS, 2006, : 335 - +
  • [23] Three-dimensional carbon architectures for electrochemical capacitors
    Song, Yu
    Liu, Tianyu
    Qian, Fang
    Zhu, Cheng
    Yao, Bin
    Duoss, Eric
    Spadaccini, Christopher
    Worsley, Marcus
    Li, Yat
    JOURNAL OF COLLOID AND INTERFACE SCIENCE, 2018, 509 : 529 - 545
  • [24] Nanofabrication approaches for functional three-dimensional architectures
    Zhao, Hangbo
    Lee, Yongjun
    Han, Mengdi
    Sharma, Bhupendra K.
    Chen, Xuexian
    Ahn, Jong-Hyun
    Rogers, John A.
    NANO TODAY, 2020, 30
  • [25] Three-dimensional zinc phosphates with open architectures
    Neeraj, S
    Natarajan, S
    CHEMISTRY OF MATERIALS, 2000, 12 (09) : 2753 - 2762
  • [26] Three-dimensional discrete wavelet transform architectures
    Weeks, M
    Bayoumi, MA
    IEEE TRANSACTIONS ON SIGNAL PROCESSING, 2002, 50 (08) : 2050 - 2063
  • [27] Three-Dimensional Flexible-Module Placement for Stacked Three-Dimensional Integration
    Noguchi, Tomohiro
    Hindawi, Omran
    Kaneko, Mineo
    2022 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS 22), 2022, : 3260 - 3264
  • [28] Three-Dimensional Architectures Constructed from Transition-Metal Dichalcogenide Nanomaterials for Electrochemical Energy Storage and Conversion
    Yun, Qinbai
    Lu, Qipeng
    Zhang, Xiao
    Tan, Chaoliang
    Zhang, Hua
    ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, 2018, 57 (03) : 626 - 646
  • [29] Three-dimensional integration of plasmonics and nanoelectronics
    Liu, Yang
    Zhang, Jiasen
    Peng, Lian-Mao
    NATURE ELECTRONICS, 2018, 1 (12): : 644 - 651
  • [30] Interconnection technology for three-dimensional integration
    Mitsuhashi, Katsunori, 1600, (28):