共 50 条
- [31] BEoL Reliability, XPS and REELS Study on low-k Dielectrics to understand Breakdown Mechanisms 2020 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2020,
- [35] Electroless CoWP capping for Cu/low-k integration ADVANCED METALLIZATION CONFERENCE 2006 (AMC 2006), 2007, : 171 - 176
- [36] Challenges of Ultra Low-k Integration in BEOL Interconnect for 45nm and Beyond PROCEEDINGS OF THE 2009 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2009, : 258 - 260
- [39] Integration and reliability of a manufacturable 130nm dual damascene Cu/low-k process 2004: 7TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUITS TECHNOLOGY, VOLS 1- 3, PROCEEDINGS, 2004, : 489 - 492
- [40] Advanced Patterning Approaches for Cu/Low-k interconnects 2017 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC), 2017,