Three-dimensional high-frequency distribution networks - Part II: Packaging and integration

被引：17
|
作者：
Henderson, RM
Herrick, KJ
Weller, TM
Robertson, SV
Kihm, RT
Katehi, LPB
机构：
[1] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA
[2] Univ S Florida, Dept Elect Engn, Tampa, FL 33620 USA
[3] Raytheon Co, Microwave Ctr, Elect Syst, El Segundo, CA 90245 USA
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2000年 / 48卷 / 10期
关键词：
coplanar transmission lines; micromachining; microwave circuits;
D O I：
10.1109/22.873891
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper describes the implementation and packaging of the components, described in Part I of this paper, to realize a three-dimensional W-band distribution network.
引用
收藏
页码：1643 / 1651
页数：9
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