Aerial image-based inspection of binary (OPC) and embedded-attenuated PSM

被引：2
|
作者：
Chang, F [1 ]
Hung, JCC [1 ]
Lin, JCH [1 ]
Rosenbusch, A [1 ]
Falah, R [1 ]
Hemar, S [1 ]
机构：
[1] Taiwan Semicond Mfg Co Ltd, Hsinchu, Taiwan
来源：
22ND ANNUAL BACUS SYMPOSIUM ON PHOTOMASK TECHNOLOGY, PTS 1 AND 2 | 2002年 / 4889卷
关键词：
aerial-image based mask inspection; 193nm technology; EAPSM;
D O I：
10.1117/12.467767
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
The paper presents a revolutionary technology to inspect advanced contact layers. Instead of finding defects based on a size-dependent defect specification, defects are found according to their impact at the wafer CD result. The inspection methodology used is aerial imaging. The main advantage of this method is that only defects, which actually affect the wafer result will be detected and classified. The paper presents first inspection results on contact layers designed for the 130nm and 90 rim technology node.
引用
收藏
页码：1010 / 1017
页数：8
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