Comparative study of Au-Sn and Sn-Ag-Cu as die-attach materials for power electronics applications

被引：13
|
作者：
Lee, Byung-Suk [1 ]
Lee, Chang-Woo [1 ]
Yoon, Jeong-Won [1 ]
机构：
[1] Korea Inst Ind Technol KITECH, Microjoining Ctr, 156 Gaetbeol Ro, Inchon 406840, South Korea
来源：
SURFACE AND INTERFACE ANALYSIS | 2016年 / 48卷 / 07期
关键词：
power electronics; interfacial reaction; intermetallic compound (IMC); Sn-3; 0Ag-0; 5Cu solder; Au-20Sn solder; SOLDER JOINTS; RELIABILITY; STATE;
D O I：
10.1002/sia.5998
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
A comparative study of Sn-3.0Ag-0.5Cu (SAC305) and Au-20Sn solders as die-attach materials for high-temperature power electronic applications was performed. The solid-state interfacial reactions of SAC305 and Au-20Sn solders with a Ni-plated Si chip and a direct-bonded-copper substrate, as well as the growth of interfacial intermetallic compound layers and interfacial stability, were investigated and compared during aging at 150 and 200 degrees C for up to 2000h. The SAC305 solder exhibited a higher interfacial intermetallic compound growth rate and a higher consumption rate of the Ni layer than the Au-20Sn solder. The Au-20Sn solder had a superior interfacial stability for high-temperature power electronic applications. Copyright (c) 2016 John Wiley & Sons, Ltd.
引用
收藏
页码：493 / 497
页数：5
相关论文
共 50 条
  • [21] High Temperature Die-attach Materials for Aerospace Power Electronics: Lifetime Tests and Modeling
    Hutzler, Aaron
    Tokarski, Adam
    Schletz, Andreas
    2015 IEEE AEROSPACE CONFERENCE, 2015,
  • [22] High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications
    Shnawah, Dhafer Abdulameer
    Said, Suhana Binti Mohd
    Sabri, Mohd Faizul Mohd
    Badruddin, Irfan Anjum
    Che, Fa Xing
    JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (09) : 2631 - 2658
  • [23] Cu Sinter Pastes for Pure-Cu Die-Attach Applications of Power Modules
    Eichinger, B.
    Behrendt, T.
    Ohm, S. N.
    Craes, F.
    Mischitz, M.
    Brunner, R.
    2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2018, : 26 - 30
  • [24] Reflow profile study of the Sn-Ag-Cu solder
    Salam, B
    Virseda, C
    Da, H
    Ekere, NN
    Durairaj, R
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2004, 16 (01) : 27 - 34
  • [25] Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications
    Jayaganthan, R
    Mohankumar, K
    Tay, AAO
    Kripesh, V
    6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 620 - 624
  • [26] Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint
    Jeong-Won Yoon
    Bo-In Noh
    Seung-Boo Jung
    Journal of Electronic Materials, 2011, 40 : 1950 - 1955
  • [27] Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications
    Anderson, Iver E.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) : 55 - 76
  • [28] Study on Sn-Ag oxidation and feasibility of room temperature bonding of Sn-Ag-Cu solder
    Wang, YH
    Howlader, MR
    Nishida, K
    Kimura, T
    Suga, T
    MATERIALS TRANSACTIONS, 2005, 46 (11) : 2431 - 2436
  • [29] Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint
    Yoon, Jeong-Won
    Noh, Bo-In
    Jung, Seung-Boo
    JOURNAL OF ELECTRONIC MATERIALS, 2011, 40 (09) : 1950 - 1955
  • [30] A Study on the Thermal Oxidation and Wettability of Lead-free Solders of Sn-Ag-Cu and Sn-Ag-Cu-In
    Lee, Hyunbok
    Cho, Sang Wan
    APPLIED SCIENCE AND CONVERGENCE TECHNOLOGY, 2014, 23 (06): : 345 - 350
12345