Wire-bond inspection in IC assembly

被引：1
|
作者：
Rajeswari, M [1 ]
Rodd, MG [1 ]
机构：
[1] UNIV SCI MALAYSIA,SCH IND TECHNOL,MINDEN 11800,PENANG,MALAYSIA
来源：
MACHINE VISION APPLICATIONS IN INDUSTRIAL INSPECTION IV | 1996年 / 2665卷
关键词：
IC assembly; wire-bonding; automated visual inspection; machine vision;
D O I：
10.1117/12.232240
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：186 / 196
页数：11
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