3D Multi-Layer Additive Manufacturing of a 2.45 GHz RF Front End

被引:0
|
作者
Arnal, Nicholas [1 ]
Ketterl, Thomas [1 ]
Vega, Yaniel [1 ]
Stratton, John [1 ]
Perkowski, Casey [2 ]
Deffenbaugh, Paul [2 ]
Church, Kenneth [2 ]
Weller, Thomas [1 ]
机构
[1] Univ S Florida, Dept Elect Engn, Tampa, FL 33620 USA
[2] Sciperio Inc, Orlando, FL USA
关键词
Direct Digital Manufacturing; Additive Manufacturing; 3D Printing; Dipole Antenna; Switched-Line Phase Shifter; Open Loop Resonator Filter;
D O I
暂无
中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
Digital additive manufacturing (AM) is emerging as a promising technology for next-generation RF systems. AM processes that combine multiple materials in a single build and can produce volumetric designs are especially interesting for 3D structural electronics. This paper reports on 3D AM fabricated components for a 2.45 GHz RF front end, specifically a circularly-polarized dipole antenna, a miniaturized capacitive-loaded open-loop resonator filter and a switched-line phase shifter. The printing process integrates fused deposition of thermoplastic substrates with micro-dispensing for deposition of conductive traces. These initial results demonstrate the strong potential for fully-printed RF front ends for light weight, low cost, conformal and readily customized applications.
引用
收藏
页数:4
相关论文
共 50 条
  • [41] 3D additive manufacturing and interface phenomena
    Ikeshoji T.-T.
    Yosetsu Gakkai Shi/Journal of the Japan Welding Society, 2017, 86 (03): : 138 - 141
  • [42] Embedded RF Packaging Via Ceramic 3D Printing and Printed Electronics Additive Manufacturing
    Obeidat, Abdullah S.
    Umar, Ashraf
    Dou, Zhi
    Alshatnawi, Firas
    Al-Haidari, Riadh
    Al-Shaibani, Waleed
    Alhendi, Mohammed
    Abdelatty, Mohamed Y.
    Boyd, Linda
    Hoel, Cathleen
    Angulo, Genaro Soto Valle
    Budka, Thomas
    Case, Jason
    Iannotti, Joseph
    Pavinatto, Felippe
    Poliks, Mark D.
    PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024, 2024, : 685 - 692
  • [43] 100-GHz FMCW Radar Front-End for ISAR and 3D Imaging
    Mencia-Oliva, B.
    Grajal, J.
    Badolato, A.
    2011 IEEE RADAR CONFERENCE (RADAR), 2011, : 389 - 392
  • [44] Multi-layer 3D chirality: new synthesis, AIE and computational studies
    Yangxue Liu
    Guanzhao Wu
    Zhen Yang
    Hossein Rouh
    Nandakumar Katakam
    Sultan Ahmed
    Daniel Unruh
    Zhonghua Cui
    Hans Lischka
    Guigen Li
    Science China(Chemistry) , 2020, (05) : 692 - 698
  • [45] ANALYTICAL THERMAL MODEL OF A GENERIC MULTI-LAYER SPACERLESS 3D PACKAGE
    Rodrigo, Nuwan
    Ghalambor, Saeed
    Haji-Sheikh, Abdolhossein
    Agonafer, Dereje
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2011, VOL 11, 2012, : 889 - 896
  • [46] A 3D Multi-layer CMOS-RRAM Accelerator for Neural Network
    Huang, Hantao
    Ni, Leibin
    Wang, Yuhao
    Yu, Hao
    Wang, Zongwei
    Cai, Yimao
    Huang, Ru
    2016 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC), 2016,
  • [47] Thermal Management and Processing Optimization for 3D Multi-layer Stacked ICs
    Lofrano, Melina
    Cherman, Vladimir
    Gerets, Carine
    Bex, Pieter
    Beyne, Eric
    2019 25TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC 2019), 2019,
  • [48] MULTI-LAYER, PSEUDO 3D THERMAL TOPOLOGY OPTIMIZATION OF HEAT SINKS
    McConnell, Caroline
    Pingen, Georg
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2012, VOL 7, PTS A-D, 2013, : 2381 - 2392
  • [49] Thermoplastic composites from curvilinear 3D multi-layer spacer fabrics
    Abounaim, Md
    Diestel, Olaf
    Hoffmann, Gerald
    Cherif, Chokri
    JOURNAL OF REINFORCED PLASTICS AND COMPOSITES, 2010, 29 (24) : 3554 - 3565
  • [50] Single-pass frame generation for multi-layer 3D circuits
    Brault, Frederic
    Morey, Philippe
    Boret, Samuel
    Bry, Benedicte
    Castel, Ghislaine
    Marques, Antonio
    Rouessard, Julien
    Segur, Christelle
    PHOTOMASK TECHNOLOGY 2022, 2022, 12293