Laser Ultrasonic Characterization of Membranes for use as Micro-Electronic Mechanical Systems (MEMS)

被引:0
|
作者
Edwards, R. S. [1 ]
Zhou, L. Q. [1 ]
Pearce, M. J. [1 ]
Prince, R. G. [1 ]
Colston, G. [1 ]
Myronov, M. [1 ]
Leadley, D. R. [1 ]
Trushkevych, O. [1 ]
机构
[1] Univ Warwick, Dept Phys, Coventry CV4 7AL, W Midlands, England
基金
欧洲研究理事会; 英国工程与自然科学研究理事会;
关键词
THIN-FILMS; GE; STRESS;
D O I
10.1063/1.4974607
中图分类号
O59 [应用物理学];
学科分类号
摘要
Germanium (Ge) on Silicon (Si) has the potential to produce a wide variety of devices, including sensors, solar cells and transistors. Modification of these materials so that a suspended membrane layer is formed, through removing regions of the Si substrate, offers the potential for sensors with a more rapid response and higher sensitivity. Such membranes are a very simple micro-electronic mechanical system (MEMS). It is essential to ensure that the membranes are robust against shock and vibration, with well-characterised resonant frequencies, prior to any practical application. We present work using laser interferometry to characterise the resonant modes of membranes produced from Ge or silicon carbide (SiC) on a Si substrate, with the membranes typically having around 1 mm lateral dimensions. Two dimensional scanning of the sample enables visualisation of each mode. The stress measured from the resonant frequencies agrees well with that calculated from the growth conditions. SiC provides a more robust platform for electronics, while Ge offers better resonant properties. This offers a potential technique for characterising production quality or lifetime testing for the MEMS produced.
引用
收藏
页数:6
相关论文
共 50 条
  • [1] In situ thermal characterization of micro-electronic components and systems
    Emigh, R
    Tavassoli, B
    FIFTH ANNUAL PAN PACIFIC MICROELECTRONICS SYMPOSIUM, PROCEEDINGS, 2000, : 153 - 157
  • [2] Laser printing of micro-electronic communication systems for smart implants applications
    Moura, C. G.
    Carvalho, O.
    Magalhaes, V. H.
    Pereira, R. S. F.
    Cerqueira, M. F.
    Goncalves, L. M. V.
    Nascimento, R. M.
    Silva, F. S.
    OPTICS AND LASER TECHNOLOGY, 2020, 128
  • [3] Near Field Microwave Microscopy for MEMS and Micro-Electronic Device Characterization<bold> </bold>
    Capoccia, Giovanni
    Sardi, Giovanni Maria
    Marcelli, Romolo
    Proietti, Emanuela
    2018 SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS (DTIP), 2018,
  • [4] MICRO-ELECTRONIC SYSTEMS RELIABILITY PREDICTION.
    O'Connor, P.D.T.
    Quality assurance London, 1979, 5 (04): : 113 - 116
  • [5] CHARACTERIZATION OF INORGANIC PARTICULATES IN MICRO-ELECTRONIC PROCESSING
    MUGGLI, RZ
    ANDERSEN, ME
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1984, 187 (APR): : 102 - INDE
  • [6] On the use of path integrals in micro-electronic design
    Schoenmaker, W
    PHYSICA STATUS SOLIDI B-BASIC RESEARCH, 2003, 237 (01): : 113 - 123
  • [7] MECHANICAL TESTS ON WELDED JOINTS IN MICRO-ELECTRONIC COMPONENTS
    VISHNEVE.BS
    AUTOMATIC WELDING USSR, 1969, 22 (09): : 52 - &
  • [8] ASPECTS OF USE OF MICRO-ELECTRONIC SWITCHING-CIRCUITS
    MEILING, W
    ENERGIETECHNIK, 1978, 28 (10): : 372 - 377
  • [9] Testing micro-electronic systems using differential identification
    Baron, C
    Geffroy, JC
    ICEMI '97 - CONFERENCE PROCEEDINGS: THIRD INTERNATIONAL CONFERENCE ON ELECTRONIC MEASUREMENT & INSTRUMENTS, 1997, : 604 - 607
  • [10] Micro-characterization of MEMS ultrasonic transducers using laser interferometry
    Blackshire, JL
    Sathish, S
    NONDESTRUCTIVE EVALUATION AND RELIABILITY OF MICRO-AND NANOMATERIAL SYSTEMS, 2002, 4703 : 184 - 193