RF MEMS Integration Present & Future Trends

被引：1
|
作者：
Polla, Dennis L. [1 ]
Wolfson, Michael B. [2 ]
机构：
[1] Def Adv Res Project Agcy, Arlington, VA 22203 USA
[2] Syst Planning Corp, Arlington, VA 22201 USA
来源：
2009 IEEE INTERNATIONAL SYMPOSIUM ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY: SYNERGY OF RF AND IC TECHNOLOGIES, PROCEEDINGS | 2009年
关键词：
Impedance matching; microresonators; interface phenomena; micromechanical signal processor arrays; microwave filters; microwave switches; Q factor;
D O I：
10.1109/RFIT.2009.5383747
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
RF MEMS technologies are rapidly being integrated into RF subsystems for a variety of applications of interest to the Department of Defense. New technologies such as RF high-Q MEMS resonators and micromechanical arrays are being developed that will enable filters and other high-performance passive components for fully integrated microsystems. Large off-chip filters will be replaced by arrays of MEMS resonators to enable monolithic chip-scale spectrum analyzers and channelizers. RF MEMS switches are being continually improved for low-loss, high-isolation switching with enhanced reliability critical to the performance of both military and commercial systems.
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页码：5 / 7
页数：3
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