Silicon Wafers; Its Manufacturing Processes and Finishing Techniques: an Overview

被引：7

作者：

Pandey, Kheelraj ^{[1
]}

Sharma, Ashwani ^{[1
]}

Singh, Ayush Kumar ^{[2
]}

机构：

[1] Amity Univ, Amity Sch Engn & Technol, Lucknow Campus, Lucknow, Uttar Pradesh, India

[2] ME Thapar Univ, Patiala, Punjab, India

来源：

SILICON | 2022年 / 14卷 / 18期

关键词：

Double disk magnetic abrasive finishing (DDMAF); Electrolytic In-Process dressing (ELID); Micro-electrical mechanical system (MEMS); Chemical mechanical polishing (CMP); Chemo-mechanical magneto-rheological finishing (CMMRF); Ball end magneto rheological finishing (BEMRF); VIBRATION;

D O I：

10.1007/s12633-022-01940-z

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

In today's polishing industry there is a great demand for obtaining a smooth, extremely flat, and mirror-like and particle free surface of silicon wafer for implanting semiconductor devices over it. In this direction, Chemical Mechanical Polishing (CMP) and its allied processes have played a vital role in the present and past scenario. In this paper, glimpses have been presented to highlight the manufacturing processes of silicon wafers and the finishing processes developed by various researchers to get better surface quality of silicon wafers. An alternative to the CMP process a recently advanced method known as double disk magnetic abrasive finishing (DDMAF) along with its chemically allied processes has been also briefed to the polish silicon wafer.

引用

页码：12031 / 12047

页数：17

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