Chelating resin containing s-bonded dithizone for the separation of copper(II), nickel(II) and zinc(II)

被引：49

作者：

Shah, R ^{[1
]}

Devi, S ^{[1
]}

机构：

[1] Maharaja Sayajirao Univ Baroda, Fac Sci, Dept Chem, Baroda 390002, Gujarat, India

来源：

TALANTA | 1998年 / 45卷 / 06期

关键词：

copper(II); nickel(II); zinc(II); separation; s-bonded dithizone;

D O I：

10.1016/S0039-9140(97)00215-4

中图分类号：

O65 [分析化学];

学科分类号：

070302 ; 081704 ;

摘要：

Analytical and physicochemical properties of a crosslinked poly (vinyl pyridine) based resin containing dithizone were examined. The resin was further used for the preconcentration of copper, nickel and zinc at batch and column level. Various conditions such as pH, equilibration time, temperature were optimised for the maximum loading of copper, nickel and zinc. The loading capacities of the resin for copper, nickel and zinc were observed to be 0.51, 0.59 and 0.65 mmol g(-1) of dry resin respectively. Elution of loaded copper, nickel and zinc from the resin was done by using 0.1 M HCl, 0.1 M H2SO4 and 0.1 M HNO3 respectively. Separation of copper, nickel and zinc in binary and ternary mixtures was achieved without any cross contamination. (C) 1998 Elsevier Science B.V.

引用

页码：1089 / 1096

页数：8

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