Microsensors, MEMS and their applications in smart structures and devices

被引:0
|
作者
Varadan, VK [1 ]
Varadan, VV [1 ]
机构
[1] Penn State Univ, Engn Elect & Acoust Mat Res Ctr, University Pk, PA 16802 USA
关键词
D O I
暂无
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
This talk will overview the MEMS and Interdigital Transducer (IDT) sensors, introduce the basis of silicon, polymer and composite material technology and characterize the selected aspects of the signal conditioning for sensors with the applications to aerospace, marine and civil structures. This will be followed by an overview of the currently available MEMS sensors and processing technologies including wafer processing lithography, film growth and deposition, ion implantation, and etching. Finally, the integration of the sensors, MEMS, and smart electronics into structures will be discussed. Wireless communication between sensors and display will be outlined. Topics to be covered include: silicon, UV curable conducting polymer, composite material sensor health monitoring and condition-based maintenance of structures using MEMS sensors transient MEMS design and biomedical devices MEMS sensors for automobile, aircraft and underwater vehicles including accelerometers and gyroscope, etc. microfabricated 'smart tongue' and 'electronic nose' sensors for food, liquor and beverages.
引用
收藏
页码:683 / 691
页数:9
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