Low loss Interconnection Solutions of Chip-to-Antenna for Millimeter-Wave Antenna-in-Package Application

被引：0
|
作者：
Chu, Chia-Ching [1 ]
Ho, Cheng-Yu [1 ]
Hsieh, Sheng-Chi [1 ]
Wang, Chen-Chao [1 ]
机构：
[1] Adv Semicond Engn ASE Inc, Elect Lab, Corp Design Div, Corp Res & Dev, 26,Chin 3rd Rd Nantze Export Proc, Kaohsiung 811, Taiwan
来源：
2020 15TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT 2020) | 2020年
关键词：
Antenna-in-Package Technology (AiP); low Dk/Df substrate materials; millimeter wave (mmWave); conductor-backed coplanar waveguide (CBCPW); interconnection loss;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Antenna-in-Package Technology (AiP) is a packaging solution technology for millimeter wave (mmWave) applications, such as automotive radar and 5G communication. AiP designers need to consider aspects such as antennas performance and interconnection loss between RF transceiver and antenna. The interconnection loss seriously affect the performance of the AiP. In this article, the conductor-backed coplanar waveguide (CBCPW) is used to evaluate the interconnection loss of three low Dk/Df substrate materials with different Dk/Df. The frequency band of CBCPW is 10 GHz to 90 GHz. The low Dk/Df substrate material can reduce the interconnection loss at 77 GHz by approximately 61.5%. In summary, designers can optimize AiP performance after reading this article.
引用
收藏
页码：64 / 67
页数：4
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