Enhanced the thermal conductivity of flexible copper foil by introducing graphene

被引:38
|
作者
Li, Jiao [1 ]
Zhang, Ping [1 ]
He, Hong [1 ]
Shi, Bo [2 ]
机构
[1] Guilin Univ Elect Technol, Sch Mech & Elect Engn, 1 Jinji Rd, Guilin 541004, Guangxi, Peoples R China
[2] Nanjing Univ Aeronaut & Astronaut, Coll Energy & Power Engn, Nanjing 210016, Jiangsu, Peoples R China
基金
中国国家自然科学基金;
关键词
Graphene/copper composite film; Thermal conductivity; Electrophoretic deposition; Vacuum hot pressing; ELECTROPHORETIC DEPOSITION; HIGH-QUALITY; OXIDE-FILMS; MICROSTRUCTURE; TEMPERATURE; PERFORMANCE; REDUCTION; GROWTH; HEAT;
D O I
10.1016/j.matdes.2019.108373
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Owing to the miniaturization, portability and wearable of electronic devices, the demand for advanced thermal management materials has increased significantly, especially for highly thermally conductive materials. In this paper, a simple and effective strategy for synthesizing high thermal conductivity copper-graphene (Cu-rGO) was proposed. The microstructure, thermal properties and thermal management capabilities of the composite film were studied. It was found that the obtained Cu-rGO film exhibits excellent flexibility and high thermal conductivity (637.7 W m(-1) K-1). It indicates that the introduction of graphene effectively enhances the thermal conductivity of Cu matrix. Besides, the experimental results show that the Cu-rGO film has a lower coefficient of thermal expansion (CTE) and excellent heat transfer properties. This work provides important guidance for the preparation of high thermal conductivity composites that meet the growing heat dissipation requirements in the future. (C) 2019 The Authors. Published by Elsevier Ltd.
引用
收藏
页数:8
相关论文
共 50 条
  • [41] Mechanical properties and thermal conductivity of graphene reinforced copper matrix composites
    Gao, Xin
    Yue, Hongyan
    Guo, Erjun
    Zhang, Hong
    Lin, Xuanyu
    Yao, Longhui
    Wang, Bao
    POWDER TECHNOLOGY, 2016, 301 : 601 - 607
  • [42] Thermal simulation of flexible LED package enhanced with copper pillars
    Yang, Liu
    Leung, Stanley Y. Y.
    Wong, Cell K. Y.
    Yuan, Cadmus A.
    Zhang Guoqi
    Sun Fenglian
    JOURNAL OF SEMICONDUCTORS, 2015, 36 (06)
  • [43] Thermal simulation of flexible LED package enhanced with copper pillars
    刘洋
    梁润园
    黄洁莹
    袁长安
    张国旗
    孙凤莲
    Journal of Semiconductors, 2015, (06) : 89 - 92
  • [44] Thermal simulation of flexible LED package enhanced with copper pillars
    刘洋
    梁润园
    黄洁莹
    袁长安
    张国旗
    孙凤莲
    Journal of Semiconductors, 2015, 36 (06) : 89 - 92
  • [45] Distinctive nanofriction of graphene coated copper foil
    Wang, Weihui
    Peng, Qing
    Dai, Yiquan
    Qian, Zhengfang
    Liu, Sheng
    COMPUTATIONAL MATERIALS SCIENCE, 2016, 117 : 406 - 411
  • [46] Thermal effects in thin copper foil
    H. D. Merchant
    Journal of Electronic Materials, 2004, 33 : 83 - 88
  • [47] Thermal effects in thin copper foil
    Merchant, HD
    JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (01) : 83 - 88
  • [48] Diglycidyl ether of bisphenol - A functionalized graphene/copper foam composite with enhanced thermal conductivity and effective electromagnetic interference shielding
    Lee, Seonmin
    Kim, Jooheon
    SYNTHETIC METALS, 2022, 284
  • [49] Flexible and environmentally friendly graphene natural rubber composites with high thermal conductivity for thermal management
    Duan, Xiaoyuan
    Cheng, Shuaishuai
    Li, Zhiwei
    Liang, Chaobo
    Zhang, Zhiyi
    Zhao, Guizhe
    Liu, Yaqing
    An, Dong
    Sun, Zhijian
    Wong, Chingping
    COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 163
  • [50] EFFECTIVE THERMAL CONDUCTIVITY OF STEEL FOIL INSULATION
    NARINSKI.DA
    SHEININ, BI
    HIGH TEMPERATURE, 1969, 7 (03) : 394 - +