Power Integrity Coanalysis Methodology for Multi-Domain High-Speed Memory Systems

被引:1
|
作者
Kim, Seungwon [1 ]
Han, Ki Jin [2 ]
Kim, Youngmin [3 ]
Kang, Seokhyeong [4 ]
机构
[1] Ulsan Natl Inst Sci & Technol, Dept Elect Engn, Ulsan 44919, South Korea
[2] Dongguk Univ, Div Elect & Elect Engn, Seoul 04620, South Korea
[3] Hongik Univ, Sch Elect & Elect Engn, Seoul 04066, South Korea
[4] Pohang Univ Sci & Technol, Dept Elect Engn, Pohang 37673, South Korea
来源
IEEE ACCESS | 2019年 / 7卷
基金
新加坡国家研究基金会;
关键词
Power integrity (PI); multi-domain coupling; high-speed memory; power delivery system; power distribution network (PDN); chip-package-PCB coanalysis; analysis methodology; low power double data rate four (LPDDR4); SIMULATION; PACKAGE; DESIGN;
D O I
10.1109/ACCESS.2019.2928896
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
With the increasing demand for state-of-the-art technologies, such as wearable devices and the Internet of things (IoT), power integrity has emerged as a major concern for high-speed, low-power interfaces that are used as mobile platforms. By using case-specific design models in a high-speed memory system, only a limited analysis of the effects of parametric variations can be performed in complex design problems, such as adjacent voltage domain coupling at high frequencies. Moreover, a conventional industrial method can be simulated only after completing the design layout; therefore, a number of iterative back-annotation processes are required for signoff; this delays the time to market. In this paper, we propose a power integrity coanalysis methodology for multiple power domains in high-frequency memory systems. Our proposed methodology can analyze the tendencies in power integrity by using parametric methods, such as parameter sweeping and Monte Carlo simulations. Our experiments prove that our proposed methodology can predict similar peak-to-peak ripple voltages that are comparable with the realistic simulations of low-power double data rate four interfaces.
引用
收藏
页码:95305 / 95313
页数:9
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